However, the active/passive layers are stacked two-dimensionally on a semiconductor substrate in a semiconductor chip structure. In such a semiconductor device, the active/passive layers are electrically connected through the metal interconnection to form a semiconductor chip. An insulating layer is used to insulate the interconnection layers from each other. Active/passive layers are electrically connected through a metal interconnection.
In general, semiconductor devices include a semiconductor substrate on which active/passive layers and electrodes are formed, and a plurality of interconnection layers that connect the electrodes to external terminals.
The disclosure relates to a semiconductor device and a method of fabricating the same, and more particularly, to a three-dimensional semiconductor device and a method of fabricating the same. Neuratron PhotoScore Ultimate 7.0.2 (Patch MPT).
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